2001年07月17日

DuPont Air Products NanoMaterials Unveils New Slurry For Enhanced Silicon Wafer Polishing

【カテゴリー】：新製品/新技術 【関連企業・団体】：なし

DuPont Air Products NanoMaterials L.L.C. (DA NanoMaterials), a 50/50 joint venture company of DuPont and Air Products and Chemicals, Inc., has unveiled a slurry formulation for enhanced silicon wafer polishing. Developed by an affiliated research team in Japan, the slurry blend will be marketed under the Mazin SR 300 trademark. This is the first product to be developed by the joint venture. The new slurry offers high removal rates with very low metal contamination on the silicon wafer surface. Mazin SR 300 can also provide good removal rates at much higher dilution ratios than other slurries, offering the opportunity to reduce polishing costs even further. Pad glazing is also kept to a minimum. DA NanoMaterials will manufacture the slurry blend at facilities in Ruabon, Wales and Utsunomiya, Japan to supply the global slurry market -- an estimated $500 million annual market that is growing at a rate of 25 percent per year. Meanwhile, Praxair Surface Technologies, Inc. has introduced a new line of colloidal silica polishing slurries used for chemical mechanical planarization (CMP) of oxide layers in semiconductor wafers. The new series of CMP slurries - designated K3000 and N3000 -- are available as either potassium- or ammonia-based products.